Michael Liehr

Title: Michael Liehr: Innovator in Semiconductor Technology

Introduction

Michael Liehr is a prominent inventor based in Guilderland, NY (US). He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to device integration.

Latest Patents

Liehr's latest patents include an "Apparatus and method for integration of through substrate vias" and a "Method for thin die-to-wafer bonding." The first patent provides a comprehensive apparatus for integrating through substrate vias (TSVs) into devices before processing device contacts. This apparatus features a semiconducting layer, CMOS devices, and a metal layer designed to facilitate the placement of bond pads for effective bonding to a second device wafer. The method outlined in this patent involves several processing steps on a wafer of semiconducting material, ensuring the successful integration of TSVs.

The second patent, "Method for thin die-to-wafer bonding," details a process for bonding a die to a base technology wafer. This method includes providing a device wafer and a carrier wafer, bonding them with adhesive, and subsequently processing the device wafer to create a backside redistribution layer. The final steps involve dicing the device wafer into individual die and bonding them to the base technology wafer.

Career Highlights

Michael Liehr is affiliated with the State University of New York, where he continues to advance research in semiconductor technologies. His work has been instrumental in developing methods that enhance the efficiency and effectiveness of semiconductor devices.

Collaborations

Liehr collaborates with notable colleagues, including Daniel Pascual and Jeremiah Hebding, contributing to a dynamic research environment that fosters innovation.

Conclusion

Michael Liehr's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the field. His work continues to influence advancements in device integration and bonding methods.