Qyriat Motzkin, Israel

Michael Faeyrman

This inventor holds 1 USPTO granted patent. Top assignee: Kla-Tencor Technologies Corporation. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Michael Faeyrman. Retrieved from https://idiyas.com/inventor/michael-faeyrman-ru8ot8sh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Michael Faeyrman and Optical-Guided Atomic Force Microscopy

Introduction

Michael Faeyrman is an inventor associated with Qyriat Motzkin, Israel, and Kla-Tencor Technologies Corporation. His patent work concerns combining optical measurement with atomic force microscopy to analyze specimens and wafer features.

Latest Patents

Faeyrman is credited with 1 patent: “Methods and Systems for Analyzing a Specimen Using Atomic Force Microscopy Profiling in Combination with an Optical Technique.”

The patent describes systems and methods that use an optical subsystem to identify a location on a specimen’s surface and guide an atomic force microscopy probe to that location. It also describes combining scatterometry-based wafer overlay measurement with atomic force microscopy measurements of wafer features.

Career Highlights

Faeyrman’s listed patent is associated with Kla-Tencor Technologies Corporation, a company working in semiconductor process control and metrology. The invention addresses how optical positional information can help direct probe-based measurements, bringing complementary measurement techniques together.

Collaborations

The provided information lists Michael Weber-Grabau and Christopher F. Bevis as Faeyrman’s coworkers. Their specific roles in the patent or related work are not specified.

Conclusion

Michael Faeyrman’s patent highlights an approach to specimen and wafer analysis that combines optical techniques with atomic force microscopy for targeted, complementary measurements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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