Company Filing History:
Years Active: 2013-2017
Title: Michael D Craig: Innovator in Thermal Interface Materials
Introduction
Michael D Craig is a notable inventor based in Painesville, OH (US). He has made significant contributions to the field of thermal interface materials, holding a total of 2 patents. His work focuses on enhancing the efficiency and effectiveness of thermal management solutions.
Latest Patents
Michael's latest patents include innovative thermal interface material assemblies. The first patent, titled "Thermal interface materials with thin film or metallization," describes a thermal interface material assembly that features a first side and a second side. This assembly incorporates a dry material with a thickness of about 0.0001 inches or less, which is strategically placed along at least a portion of the first side of the thermal interface material. The second patent, "Thermal interface material with thin transfer film or metallization," similarly outlines a thermal interface material assembly. In this case, the dry material has a thickness of about 0.0005 inches or less and is also disposed along at least a portion of the first side of the thermal interface material.
Career Highlights
Michael D Craig is currently associated with Laird Technologies GmbH, where he continues to innovate in the field of thermal management. His expertise in developing advanced thermal interface materials has positioned him as a key player in this industry.
Collaborations
Michael has collaborated with talented individuals such as Jason L Strader and Mark Wisniewski, contributing to the advancement of thermal interface technologies.
Conclusion
Michael D Craig's work in thermal interface materials showcases his dedication to innovation and excellence in engineering. His patents reflect a commitment to improving thermal management solutions, making a significant impact in the field.