The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
May. 20, 2013
Applicant:
Laird Technologies, Inc., Earth City, MO (US);
Inventors:
Jason L. Strader, Cleveland, OH (US);
Mark Wisniewski, Mentor, OH (US);
Karen Bruzda, Cleveland, OH (US);
Michael D. Craig, Painesville, OH (US);
Assignee:
Laird Technologies, Inc., Earth City, MO (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/04 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); B32B 3/10 (2006.01); B32B 25/08 (2006.01); B32B 25/20 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/28 (2006.01); B32B 37/10 (2006.01); B32B 37/12 (2006.01); B32B 37/14 (2006.01); B32B 37/15 (2006.01); H05K 7/20 (2006.01); C09J 7/02 (2006.01); C09J 7/04 (2006.01); C09J 183/04 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/40 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); B22F 7/04 (2006.01); B32B 3/14 (2006.01); B29C 39/14 (2006.01); B29C 39/20 (2006.01); B29C 41/24 (2006.01); B29C 41/32 (2006.01); B29C 43/22 (2006.01); B29C 43/30 (2006.01); B29C 43/44 (2006.01); B32B 7/00 (2006.01); B32B 37/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); B22F 7/04 (2013.01); B32B 3/14 (2013.01); H01L 23/3735 (2013.01); H01L 23/42 (2013.01); B29C 39/14 (2013.01); B29C 39/20 (2013.01); B29C 41/24 (2013.01); B29C 41/32 (2013.01); B29C 43/22 (2013.01); B29C 43/30 (2013.01); B29C 43/44 (2013.01); B32B 3/10 (2013.01); B32B 7/00 (2013.01); B32B 7/04 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 25/08 (2013.01); B32B 25/20 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/28 (2013.01); B32B 27/283 (2013.01); B32B 37/00 (2013.01); B32B 37/10 (2013.01); B32B 37/12 (2013.01); B32B 37/14 (2013.01); B32B 37/15 (2013.01); B32B 2255/205 (2013.01); B32B 2307/30 (2013.01); B32B 2307/302 (2013.01); B32B 2307/402 (2013.01); B32B 2307/404 (2013.01); B32B 2307/51 (2013.01); B32B 2307/748 (2013.01); B32B 2457/00 (2013.01); C09J 7/02 (2013.01); C09J 7/0225 (2013.01); C09J 7/0239 (2013.01); C09J 7/04 (2013.01); C09J 183/04 (2013.01); C09J 2203/30 (2013.01); C09J 2203/326 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 23/373 (2013.01); H01L 23/3737 (2013.01); H01L 23/40 (2013.01); H01L 2023/4037 (2013.01); H01L 2924/0002 (2013.01); H05K 7/20 (2013.01); H05K 7/20454 (2013.01); H05K 7/20472 (2013.01); H05K 7/20481 (2013.01); Y10T 156/10 (2015.01); Y10T 428/14 (2015.01); Y10T 428/1471 (2015.01); Y10T 428/1476 (2015.01); Y10T 428/24802 (2015.01); Y10T 428/265 (2015.01); Y10T 428/2839 (2015.01); Y10T 428/2852 (2015.01);
Abstract
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.