Michael Brigham

Title: Michael Brigham: Innovator in Through-Silicon Via Technology

Introduction

Michael Brigham is a notable inventor based in Bolton, Vermont, who has made significant contributions to the field of semiconductor technology. He holds one patent that showcases his innovative approach to enhancing through-silicon via (TSV) structures, which are crucial for modern electronic devices.

Latest Patents

Brigham's patent, titled "Liner-free through-silicon-vias formed by selective metal deposition - Structures for a through-silicon via and methods of forming a structure for a through-silicon via," presents a novel method for creating TSVs. The structure includes a substrate with a trench and surfaces bordering the trench. Additionally, the through-silicon via features a layer inside the trench that is in direct contact with the substrate surfaces. This innovation aims to improve the efficiency and reliability of semiconductor devices.

Career Highlights

Michael Brigham is currently employed at GlobalFoundries U.S. Inc., a leading semiconductor manufacturer. His work at GlobalFoundries has allowed him to apply his expertise in TSV technology, contributing to the advancement of the company's product offerings.

Collaborations

Throughout his career, Brigham has collaborated with talented individuals such as David Thomas and Cody Soule. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Michael Brigham's contributions to through-silicon via technology exemplify the spirit of innovation in the semiconductor industry. His patent and work at GlobalFoundries highlight his commitment to advancing technology and improving electronic devices.