This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Intel Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Micha Shahar: Innovator in Chip Interconnect Technology
Introduction
Micha Shahar is a notable inventor based in Petah Tikva, Israel. He has made significant contributions to the field of chip interconnect technology, particularly through his innovative patent that addresses testing and repairing interconnects between chips. His work is essential in enhancing the reliability and performance of electronic devices.
Latest Patents
Micha Shahar holds a patent for a solution that focuses on the test, repair, and diagnostic processes for chip-to-chip interconnects. The patent describes a method where a first finite state machine (FSM) on a chip is coupled to a set of transmit lanes. To test each transmit lane individually, the FSM applies a first periodic signal to the lane under test while simultaneously applying a second periodic signal to the other lanes. This innovative approach allows for effective comparison of detected signals against expected responses, ensuring the integrity of chip interconnects.
Career Highlights
Micha Shahar is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise in chip interconnects has positioned him as a valuable asset to the company.
Collaborations
Micha collaborates with Adithya Kashyap, who is also a talented professional in the field. Their combined efforts contribute to advancements in technology and innovation at Intel Corporation.
Conclusion
Micha Shahar's work in chip interconnect technology exemplifies the importance of innovation in the electronics industry. His patent and ongoing contributions are vital for the future of reliable electronic devices.