Jeonju-si, South Korea

Mi-Ja Han

USPTO Granted Patents = 19 

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 53(Granted Patents)


Location History:

  • Suwon-si, KR (2010 - 2011)
  • Junjoo-si, KR (2012)
  • Jeonju-si, KR (2011 - 2014)

Company Filing History:


Years Active: 2010-2014

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19 patents (USPTO):Explore Patents

Title: Innovations by Mi-Ja Han: Pioneering Electromagnetic Bandgap Structures

Introduction: Mi-Ja Han, a prominent inventor based in Jeonju-si, South Korea, has made significant contributions to the field of electromagnetic technologies. With a total of 19 patents to his name, Han's work focuses on addressing critical issues such as mixed signal problems and electromagnetic interference (EMI) noise shielding.

Latest Patents: Among his latest innovations, Han has developed an electromagnetic bandgap structure and a printed circuit board designed specifically to tackle mixed signal problems. This invention integrates multiple layers, including metal and dielectric layers, to create a robust structure that enhances signal integrity. Additionally, he has introduced an EMI noise shield board that incorporates an electromagnetic bandgap structure, preventing EMI noise from radiating externally, thereby safeguarding electronic components.

Career Highlights: Mi-Ja Han is currently associated with Samsung Electro-Mechanics Co., Ltd., where he continues to push the boundaries of technology. His innovative spirit and technical expertise have solidified his reputation as a leader in the realm of electromagnetic solutions.

Collaborations: Han collaborates with talented colleagues such as Han Bit Kim and Dae-Hyun Park, contributing to a synergistic environment that fosters creativity and innovation within the organization. Their combined efforts lead to groundbreaking advancements in the field.

Conclusion: Mi-Ja Han exemplifies the qualities of a visionary inventor, continually striving to improve technological systems through his innovative patents. His recent works, specifically in the area of electromagnetic bandgap structures and EMI shielding, not only address pressing challenges in the electronics industry but also pave the way for future innovations.

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