The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 2014

Filed:

Mar. 02, 2012
Applicants:

Dae-hyun Park, Ulsan, KR;

Han Kim, Yongin-si, KR;

Mi-ja Han, Jeonju-si, KR;

Ja-bu Koo, Suwon-si, KR;

Inventors:

Dae-Hyun Park, Ulsan, KR;

Han Kim, Yongin-si, KR;

Mi-Ja Han, Jeonju-si, KR;

Ja-Bu Koo, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0236 (2013.01); H05K 2201/09618 (2013.01); H05K 2201/09718 (2013.01); H05K 2201/09781 (2013.01); H05K 1/115 (2013.01); H05K 2201/09536 (2013.01); H05K 1/0222 (2013.01); H05K 1/0219 (2013.01); H05K 2201/09309 (2013.01);
Abstract

An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.


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