Company Filing History:
Years Active: 2011-2014
Title: Innovations of Ja-Bu Koo
Introduction
Ja-Bu Koo is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of electromagnetic bandgap structures and printed circuit boards. With a total of 6 patents to his name, Koo continues to push the boundaries of technology.
Latest Patents
Koo's latest patents include an electromagnetic bandgap structure and a printed circuit board designed to address mixed signal problems. The first patent describes an electromagnetic bandgap structure that consists of multiple layers, including a first metal layer, dielectric layers, and vias that connect various components. The second patent outlines a similar structure with conductive plates arranged in specific directions, featuring stitching vias that electrically connect adjacent conductive portions.
Career Highlights
Ja-Bu Koo is currently employed at Samsung Electro-Mechanics Co., Ltd., where he applies his expertise in developing advanced electronic components. His work has been instrumental in enhancing the performance and reliability of electronic devices.
Collaborations
Koo has collaborated with talented coworkers, including Han Bit Kim and Mi-Ja Han, who contribute to the innovative projects at Samsung Electro-Mechanics Co., Ltd. Their teamwork fosters a creative environment that leads to groundbreaking inventions.
Conclusion
Ja-Bu Koo's contributions to the field of electromagnetic bandgap structures and printed circuit boards highlight his innovative spirit and dedication to advancing technology. His work continues to influence the electronics industry significantly.