The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 20, 2011

Filed:

Nov. 13, 2008
Applicants:

Han Kim, Yongin-si, KR;

Ja-bu Koo, Suwon-si, KR;

Dae-hyun Park, Ulsan, KR;

Inventors:

Han Kim, Yongin-si, KR;

Ja-Bu Koo, Suwon-si, KR;

Dae-Hyun Park, Ulsan, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electromagnetic bandgap structure and a printed circuit board having the same are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure can include a plurality of conductive layers, placed between two conductive layers; and a stitching via, configured to make an electrical connection between any two conductive layers of the conductive layers. Here, the stitching via can include a first via, one end part of the first via configured to any one of the two conductive plates; a second via, one end part of the second via configured to the other of the two conductive plates; and a connection pattern, placed on a planar surface that is different from the conductive plates, between the two conductive layers and configured to make an electrical connection between the other end part of the first via and the other end part of the second via. Any one of the first via and the second via can be formed to penetrate a same planar surface as at least one of the two conductive layers.


Find Patent Forward Citations

Loading…