The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8422248 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 16, 2013

Filed:

Aug. 22, 2011
Applicants:

Han Kim, Yongin-si, KR;

Jae-joon Lee, Suwon-si, KR;

Mi-ja Han, Jeonju-si, KR;

Dae-hyun Park, Suwon-si, KR;

Inventors:

Han Kim, Yongin-si, KR;

Jae-Joon Lee, Suwon-si, KR;

Mi-Ja Han, Jeonju-si, KR;

Dae-Hyun Park, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electromagnetic bandgap structure, including: a first metal layer; a first dielectric layer, stacked in the first metal layer; a metal plate, stacked in the first dielectric layer; a via, having one end part which is connected to the first metal layer; a second dielectric layer, stacked in the metal plate and the first dielectric layer; and a second metal layer, stacked in the second dielectric layer, whereas the other end part of the via is connected to a via land which is placed in a hole formed in the metal plate, and the via land is connected to the metal plate through a metal line.


Find Patent Forward Citations

Kim, Han. (2013). Electromagnetic bandgap structure and printed circuit board (U.S. Patent No. 8422248). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8422248

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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