This inventor holds 2 USPTO granted patents. Top assignees: Samsung Electronics Co., Ltd., Sungkyunkwan University. Active years: 2016-2017.
Company Filing History:
1 out of 132,108 
1 out of 1,349 
Years Active: 2016-2017
Title: Mi Hwa Yu: Innovator in Semiconductor Technology
Introduction
Mi Hwa Yu is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and effectiveness of semiconductor packages.
Latest Patents
Mi Hwa Yu's latest patents include a bonding wire for semiconductor packages and a semiconductor package that incorporates this innovative bonding wire. The bonding wire features a core portion made of silver (Ag) and a shell layer composed of gold (Au), with a thickness ranging from 2 nm to 23 nm. The semiconductor package itself consists of a package body that includes both a first and second electrode structure, along with a semiconductor light-emitting device that connects to these structures via the bonding wire.
Career Highlights
Throughout his career, Mi Hwa Yu has worked with notable organizations, including Samsung Electronics Co., Ltd. and Sungkyunkwan University. His experience in these institutions has allowed him to develop and refine his inventions, contributing to advancements in semiconductor technology.
Collaborations
Mi Hwa Yu has collaborated with several professionals in his field, including Soo Moon Park and Il Woo Park. These collaborations have further enriched his research and development efforts.
Conclusion
Mi Hwa Yu is a distinguished inventor whose work in semiconductor technology has led to innovative solutions that enhance the performance of semiconductor packages. His contributions continue to impact the industry positively.