Mi-Chun Hung

Title: Mi-Chun Hung: Innovator in Wiring Structures

Introduction

Mi-Chun Hung is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor engineering, particularly in the development of wiring structures. His innovative approach has led to the creation of a unique wiring package and method of manufacturing it.

Latest Patents

Mi-Chun Hung holds 1 patent for his invention titled "Wiring package and method of manufacturing the same." This patent describes a wiring structure that includes a conductive structure, a first fan-out structure, and a second fan-out structure. The first fan-out structure is positioned on the conductive structure and features a first circuit layer, while the second fan-out structure also rests on the conductive structure and contains a second circuit layer. Notably, the thickness of the first circuit layer differs from that of the second circuit layer, showcasing his innovative design.

Career Highlights

Mi-Chun Hung is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing the manufacturing processes of wiring structures, contributing to the efficiency and effectiveness of semiconductor devices.

Collaborations

Mi-Chun has collaborated with talented coworkers, including Chih-Yi Huang and Chen-Chao Wang. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Mi-Chun Hung's contributions to the field of semiconductor engineering, particularly through his patented wiring structure, highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future advancements in technology.