Advanced Semiconductor Engineering, Inc.

Mi-Chun Hung

Chen-Chao Wang

Chih-Yi Huang

At least some embodiments of the present disclosure relate to a wiring structure and a method for manufacturing a wiring structure. The wiring structure includes a conductive structure, a first fan-out structure, and a second fan-out structure. The first fan-out structure is disposed on the conductive structure and includes a first circuit layer. The second fan-out structure is disposed on the conductive structure, and includes a second circuit layer. A thickness of the first circuit layer is different from a thickness of the second circuit layer.

Growing community of inventors

Kaohsiung, Taiwan

Mi-Chun Hung