Company Filing History:
Years Active: 2022-2023
Title: Innovations by Inventor Meng Mei
Introduction
Meng Mei is a notable inventor based in Suzhou, China. He has made significant contributions to the field of package substrate manufacturing and electrical performance testing of packaged chips. With a total of 2 patents to his name, Meng Mei continues to push the boundaries of innovation in his industry.
Latest Patents
Meng Mei's latest patents include a manufacturing method for a package substrate. This method involves forming a package substrate using a first dielectric layer made from fiberglass of a first width and a second dielectric layer made from fiberglass of a second width. The two widths differ, and the weaving direction of the fiberglass in the first dielectric layer is oriented at 90 degrees relative to that in the second dielectric layer. Another significant patent is a method for testing the electrical performance of packaged chips. This method outlines the process of creating an electrical performance test structure, which includes providing two wafers, forming a top metal layer on each, and packaging them for testing.
Career Highlights
Meng Mei is currently employed at Montage Technology (Kunshan) Co., Ltd. His work focuses on advancing technologies related to semiconductor packaging and testing. His innovative approaches have garnered attention in the field, contributing to the efficiency and reliability of electronic components.
Collaborations
Meng Mei collaborates with talented coworkers, including Gang Shi and Peichun Wang. Their combined expertise fosters a creative environment that enhances the development of new technologies.
Conclusion
In summary, Meng Mei is a distinguished inventor whose work in package substrate manufacturing and electrical performance testing has made a significant impact in the technology sector. His patents reflect a commitment to innovation and excellence in engineering.