The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 21, 2023
Filed:
May. 15, 2020
Applicant:
Montage Technology (Kunshan) Co., Ltd., Jiangsu, CN;
Inventors:
Assignee:
MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD., Jiangsu, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/03 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0044 (2013.01); H05K 1/0306 (2013.01); H05K 1/0366 (2013.01); H05K 3/0011 (2013.01); H05K 3/06 (2013.01); H05K 2201/029 (2013.01);
Abstract
A manufacturing method for a package substrate, the method including: forming a package substrate by a first dielectric layer formed by weaving at least fiberglass of a first width and a second dielectric layer formed by weaving at least fiberglass of a second width. The second width is different from the first width, and the weaving direction of the fiberglass in the first dielectric layer is 90° relative to the weaving direction of the fiberglass in the second dielectric layer.