Company Filing History:
Years Active: 2022-2023
Title: The Innovations of Guangfeng Li
Introduction
Guangfeng Li is a notable inventor based in Suzhou, China, recognized for his contributions to the field of package substrate manufacturing. With a total of two patents to his name, Li has made significant advancements that enhance the efficiency and performance of packaged chips.
Latest Patents
Li's latest patents showcase his expertise in manufacturing techniques. One of his inventions is a *package substrate manufacturing method*, which describes a process for creating a package substrate using a first dielectric layer formed by weaving fiberglass of a first width and a second dielectric layer woven from fiberglass of a different width. This method emphasizes that the weaving direction of the fiberglass in the first dielectric layer is oriented at 90 degrees relative to that in the second layer.
Additionally, he holds a patent for a *method for testing electrical performance of packaged chips*. This innovative method involves providing two wafers, forming a top metal layer on both, and creating bumps on parts of this layer. The process details how the top metal layer, which is not directly under the bumps, is removed in one wafer, while the other wafer retains its top metal layer. This structure allows the second wafer to serve as a test reference for the electrical performance of the first, enhancing the reliability of chip packaging.
Career Highlights
Guangfeng Li currently works at Montage Technology (Kunshan) Co., Ltd., where he applies his inventiveness to develop advanced packaging solutions. His work has gained recognition within the industry, underlining his role as a pivotal figure in innovations related to semiconductor technology and materials.
Collaborations
Li collaborates closely with several talented professionals, including Meng Mei and Gang Shi, who contribute to his projects. These partnerships foster a dynamic work environment that drives creativity and generates impactful inventions.
Conclusion
Guangfeng Li's commitment to innovation and excellence in the field of package substrate manufacturing highlights the importance of patented inventions in advancing technology. His latest patents not only reflect his skills as an inventor but also pave the way for improved methodologies in the electronics industry, underscoring his valuable contributions to the field.