Montage Technology (kunshan) Co., Ltd.

Meng Mei

Gang Shi

Peichun Wang

Guangfeng Li

A manufacturing method for a package substrate, the method including: forming a package substrate by a first dielectric layer formed by weaving at least fiberglass of a first width and a second dielectric layer formed by weaving at least fiberglass of a second width. The second width is different from the first width, and the weaving direction of the fiberglass in the first dielectric layer is 90&#xb0; relative to the weaving direction of the fiberglass in the second dielectric layer.

Package substrate manufacturing method

A method for manufacturing an electrical performance test structure of packaged chip, and a method for testing electrical performance of packaged chip, including: providing a first wafer and a second wafer, forming a top metal layer on the first wafer and the second wafer respectively, forming bumps on part of the top metal layer of the first wafer and on part of the top metal layer of the second wafer respectively, removing the top metal layer that is not directly beneath the bumps in the first wafer, and completely retaining the top metal layer in the second wafer, and packaging the first wafer to a first die and packaging the second wafer to a second die, wherein the second die is used as a test structure, and the electrical performance of the second die is used as a reference for electrical performance of the first die.

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Suzhou, China

Meng Mei