This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations by Inventor Meng-Han Wang
Introduction
Meng-Han Wang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology. His work focuses on enhancing the reliability and functionality of IC chip packages.
Latest Patents
Meng-Han Wang holds a patent for "Interconnect structures in integrated circuit chips." This patent describes an integrated circuit (IC) chip package and a method of fabricating the same. The IC chip package includes a device layer on a first surface of a substrate, a first interconnect structure on the device layer, and a second interconnect structure on the second surface of the substrate. The first interconnect structure features a fault detection line in a first metal line layer, which is configured to emit an electrical or optical signal indicative of the presence or absence of a defect in the device layer. Additionally, it includes a metal-free region on the fault detection line and a metal line adjacent to the fault detection line in the first metal line layer. The fault detection line is electrically connected to the device layer.
Career Highlights
Meng-Han Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in semiconductor manufacturing. His expertise in integrated circuits has positioned him as a valuable asset in the industry.
Collaborations
He has collaborated with notable colleagues, including Yu-Ting Lin and Wei-Cheng Liu, contributing to advancements in semiconductor technology.
Conclusion
Meng-Han Wang's innovative work in integrated circuit technology exemplifies the importance of advancements in this field. His contributions continue to influence the development of reliable and efficient semiconductor solutions.