This inventor holds 1 USPTO granted patent. Top assignee: Phoenix Precision Technology Corporation. Active years: 2008.
Company Filing History:
Years Active: 2008
Title: The Innovative Contributions of Meng-Da Chou in Circuit Board Technology
Introduction
Meng-Da Chou, based in Hsin-Chu, Taiwan, is recognized for his inventive contributions to circuit board technology. With one notable patent to his name, Chou has made significant advancements in the method for fabricating conductive bumps on circuit boards, a critical component in modern electronic devices.
Latest Patents
Chou's patent, titled "Method for Fabricating Conductive Bump of Circuit Board," introduces a novel approach to enhance the fabrication process of conductive bumps. This method involves providing a circuit board with both a first and a second surface, forming circuit structures with conductive pads on each surface, and creating conductive structures within the board to facilitate electrical connections. Additionally, the process strategically employs an insulating layer with openings to expose conductive pads, ultimately leading to the successful formation of conductive bumps through an electroplating process on both surfaces.
Career Highlights
Currently, Meng-Da Chou is associated with Phoenix Precision Technology Corporation, where he leverages his expertise in innovative circuit board solutions. His work not only contributes to the production efficiency and quality of electronic components but also positions his company at the forefront of technological advancement in the industry.
Collaborations
Throughout his career, Chou has collaborated with several knowledgeable professionals, including Shih-Ping Hsu and Sao-Hsia Tang. These partnerships have fostered a creative environment where innovative ideas flourish, ultimately benefiting their collective research and development efforts.
Conclusion
Meng-Da Chou's innovative methods for fabricating conductive bumps on circuit boards exemplify the significant impact that individual inventors can have on technology. Through his patent and collaborative efforts, Chou continues to enhance the efficiency of electronic manufacturing, paving the way for future innovations in this ever-evolving field.