Meng Chun Ko

Title: Innovations by Meng Chun Ko

Introduction

Meng Chun Ko is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of adhesive materials, showcasing his expertise through his innovative patent. His work is particularly relevant in industries that require advanced adhesive solutions.

Latest Patents

Meng Chun Ko holds a patent for an adhesive material that comprises a polymeric component, a heat conductive filler, and a curing agent. The polymeric component constitutes 30%-60% by volume of the adhesive material and includes thermoset epoxy resin along with a polymeric modifier designed to enhance the impact resistance of the thermoset epoxy resin. The polymeric modifier can be thermoplastic, rubber, or a mixture of both, making up 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed within the polymeric component and accounts for 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at temperatures below 140°C. This innovative adhesive material boasts a heat conductivity greater than 3 W/m-K, making it suitable for various applications.

Career Highlights

Meng Chun Ko is associated with Polytronics Technology Corporation, where he has been instrumental in developing cutting-edge adhesive technologies. His work has not only advanced the company's product offerings but has also contributed to the broader field of materials science.

Collaborations

Meng Chun Ko has collaborated with talented coworkers such as Kuo Hsun Chen and Yi An Sha. Their combined efforts have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Meng Chun Ko's contributions to adhesive materials exemplify the spirit of innovation in the field. His patent reflects a deep understanding of material properties and their applications, positioning him as a key figure in the industry.