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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9340712 B1

PDFFull Text
Date of Patent:
May. 17, 2016

Filed:

Dec. 20, 2013

Adhesive material

Applicants:

Kuo Hsun Chen, Toufen Town, TW;

Meng Chun Ko, Taichung, TW;

Yi an Sha, New Taipei, TW;

Hsiang Yun Yang, Hsin-Chu Hsien, TW;

Inventors:

Kuo Hsun Chen, Toufen Town, TW;

Meng Chun Ko, Taichung, TW;

Yi An Sha, New Taipei, TW;

Hsiang Yun Yang, Hsin-Chu Hsien, TW;

Assignee:

POLYTRONICS TECHNOLOGY CORP., Hsinchu, TW;

Attorney:

Egbert Law Offices, PLLC

Primary Examiner:

Mark Kaucher

Assistant Examiner:

Kregg Brooks

Int. Cl.
CPC ...
C09J 11/04 (2006.01); C09J 163/00 (2006.01); C09J 113/00 (2006.01); C09J 11/06 (2006.01); C09J 163/02 (2006.01); C09J 163/04 (2006.01); C09J 171/12 (2006.01); C09J 7/00 (2006.01); C08G 59/40 (2006.01); C08G 59/50 (2006.01); H01L 33/64 (2010.01); H05K 7/20 (2006.01); C09J 109/02 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/50 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C09J 109/02 (2013.01); C09J 113/00 (2013.01); H01L 33/64 (2013.01); H05K 7/20 (2013.01); C08G 2650/56 (2013.01);
Abstract

An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.

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