Polytronics Technology Corporation

Meng Chun Ko

Yi An Sha

Kuo Hsun Chen

Hsiang Yun Yang

An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140&#xb0; C. The adhesive material has a heat conductivity greater than 3 W/m-K.

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Taichung, Taiwan

Meng Chun Ko