Hsinchu, Taiwan

Meng-Chun Hsieh

This inventor holds 1 USPTO granted patent. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Meng-Chun Hsieh. Retrieved from https://idiyas.com/inventor/meng-chun-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Meng-Chun Hsieh: Innovator in Semiconductor Processes

Introduction

Meng-Chun Hsieh is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances semiconductor processing efficiency.

Latest Patents

Meng-Chun Hsieh holds a patent titled "System and method for performing semiconductor processes with coated bell jar." This patent describes a semiconductor process system that includes a process chamber with a wafer support designed to hold a wafer. The system features a bell jar that is positioned over the wafer during the semiconductor process. Notably, the interior surface of the bell jar is coated with a rough coating, which can include zirconium, to improve the processing environment.

Career Highlights

Meng-Chun Hsieh is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work at this prestigious company has allowed him to contribute to cutting-edge technologies and advancements in semiconductor manufacturing.

Collaborations

Some of his coworkers include Tsung-Yu Tsai and Hsing-Yuan Huang, who have collaborated with him on various projects within the semiconductor field.

Conclusion

Meng-Chun Hsieh's innovative contributions to semiconductor processes exemplify the importance of research and development in technology. His patent reflects a commitment to improving manufacturing techniques in the semiconductor industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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