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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11939664 B1

PDFFull Text
Date of Patent:
Mar. 26, 2024

Filed:

Aug. 30, 2021

System and method for performing semiconductor processes with coated bell jar

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Meng-Chun Hsieh, Hsinchu, TW;

Tsung-Yu Tsai, Hsinchu, TW;

Hsing-Yuan Huang, Hsinchu, TW;

Chih-Chang Wu, Hsinchu, TW;

Szu-Hua Wu, Hsinchu, TW;

Chin-Szu Lee, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

Seed IP Law Group LLP

Primary Examiner:

Rodney G McDonald

Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 14/50 (2006.01); H01L 21/677 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
C23C 14/50 (2013.01); C23C 14/34 (2013.01); H01L 21/67748 (2013.01); H01L 21/68707 (2013.01);
Abstract

A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

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Hsieh, Meng-Chun. (2024). System and method for performing semiconductor processes with coated bell jar (U.S. Patent No. 11939664). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11939664

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