Tainan County, Taiwan

Men-Shew Liu


Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2008-2009

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3 patents (USPTO):Explore Patents

Title: Innovations of Men-Shew Liu

Introduction

Men-Shew Liu is a notable inventor based in Tainan County, Taiwan. He has made significant contributions to the field of chip packaging technology. With a total of three patents to his name, Liu has demonstrated his expertise and innovative spirit in the industry.

Latest Patents

One of Liu's latest patents is titled "Chip package and method of manufacturing the same." This invention includes a chip package that features a metal layer, a film-like circuit layer, a chip, a lead matrix, and an encapsulant. The film-like circuit layer is positioned on the metal layer and consists of an insulating film and a circuit layer with multiple conductive traces. The chip is electrically connected to these traces, while the lead matrix contains leads that connect to the traces as well. The encapsulant serves to protect the chip, circuit layer, leads, and metal layer.

Another significant patent is the "Light emitting chip package and manufacturing method thereof." This method involves bonding a patterned metal plate with thermal enhancement to a substrate and attaching a film-like circuit layer to it. Conductive wires connect the circuit layer to the contacts on the metal plate. A molding process encapsulates the components, improving the heat dissipation efficiency of the light emitting chip package.

Career Highlights

Men-Shew Liu is currently employed at Chipmos Technologies Inc., where he continues to innovate in the field of semiconductor packaging. His work has contributed to advancements in chip technology, enhancing performance and efficiency.

Collaborations

Liu has collaborated with notable coworkers, including Yu-Tang Pan and Shih-Wen Chou. Their combined efforts have led to significant developments in their respective fields.

Conclusion

Men-Shew Liu's contributions to chip packaging technology through his patents and work at Chipmos Technologies Inc. highlight his role as an influential inventor in the industry. His innovative designs and methods continue to shape the future of semiconductor technology.

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