The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 2009
Filed:
May. 09, 2007
Yu-tang Pan, Tainan County, TW;
Men-shew Liu, Tainan County, TW;
Shih-wen Chou, Tainan County, TW;
ChipMOS Technologies Inc., Hsinchu, TW;
Abstract
A chip package including a metal layer, a film-like circuit layer, a chip, a lead matrix and an encapsulant is provided. The film-like circuit layer disposed on the metal layer includes an insulating film disposed on the metal layer and a circuit layer disposed on the insulating film. The circuit layer has a plurality of conductive traces. The chip disposed above the metal layer is electrically connected to the conductive traces. The lead matrix having a plurality of leads is disposed outside the chip. At least part of the leads are electrically connected to the conductive traces. The encapsulant at least encapsulates the chip, the film-like circuit layer, at least part of the leads, and at least part of the metal layer.