Hillsboro, OR, United States of America

Mehran Adyani-yazdi

This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mehran Adyani-yazdi. Retrieved from https://idiyas.com/inventor/mehran-adyani-yazdi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations of Mehran Adyani-yazdi

Introduction

Mehran Adyani-yazdi is an accomplished inventor based in Hillsboro, Oregon. He is known for his significant contributions to the field of semiconductor technology. His work focuses on enhancing the performance of semiconductor chips in extreme environments.

Latest Patents

One of his notable patents is titled "Heating element and supporting circuitry for adapting a nominally rated semiconductor chip to an extremely cold environment." This patent describes a thermal control circuit that includes a heating element integrated within an electronic circuit board. The circuit is designed to ensure that the semiconductor chip reaches its lowest rated operating temperature before being placed in a fully operational state. This innovation is crucial for applications where semiconductor chips are exposed to extremely cold conditions.

Career Highlights

Mehran Adyani-yazdi is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies that impact various industries.

Collaborations

He collaborates with talented professionals, including his coworker Aslam Haswarey, to drive innovation and develop new technologies.

Conclusion

Mehran Adyani-yazdi's work exemplifies the spirit of innovation in the semiconductor industry. His contributions, particularly in thermal control circuits, are paving the way for advancements in technology that can withstand extreme conditions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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