The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2025

Filed:

Apr. 24, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Aslam Haswarey, Portland, OR (US);

Kevin Wells, Folsom, CA (US);

Mehran Adyani-Yazdi, Hillsboro, OR (US);

Daniel R. Russell, Hillsboro, OR (US);

James C. Mowery, Beaverton, OR (US);

Vinesh Lal, Beaverton, OR (US);

Xiangying Ma, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H10D 89/10 (2025.01);
U.S. Cl.
CPC ...
H01L 23/345 (2013.01); H05K 1/0212 (2013.01); H05K 1/181 (2013.01); H10D 89/105 (2025.01);
Abstract

A thermal control circuit is described. The thermal control circuit includes a heating element disposed within an electronic circuit board having a semiconductor chip disposed thereon. The thermal control circuit includes a power management integrated circuit coupled to the heating element. The power management integrated circuit is to enable the heating element to heat the semiconductor chip at least to the semiconductor chips' lowest rated operating temperature prior to the semiconductor chip being placed in a fully operational state.


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