This inventor holds 3 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2007-2010.
Company Filing History:
Years Active: 2007-2010
Title: The Innovative Contributions of Matthew J Schaenzer
Introduction
Matthew J Schaenzer is a notable inventor based in Phoenix, AZ. He has made significant contributions to the field of electronic packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and effectiveness of electronic assemblies.
Latest Patents
One of Schaenzer's latest patents is for an electronic packaging apparatus and method. This invention includes a substrate with a device attached to it, along with a thermally conductive heat spreader that covers the device and part of the substrate. A metal fills the space between the device and the heat spreader, improving thermal management. Another patent involves thermally coupling an integrated heat spreader to a heat sink base. This method allows for selective plating with a solder wetting material, enhancing the connection between the heat sink and the heat spreader.
Career Highlights
Matthew J Schaenzer is currently employed at Intel Corporation, where he continues to innovate in the field of electronic packaging. His work has contributed to advancements in thermal management technologies, which are crucial for modern electronic devices.
Collaborations
Schaenzer has collaborated with notable coworkers such as Thomas John Fitzgerald and Manjit Dhindsa. These partnerships have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Matthew J Schaenzer's contributions to electronic packaging and thermal management are noteworthy. His patents reflect a commitment to improving technology in the electronics industry. His work at Intel Corporation continues to influence advancements in this vital field.