The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 02, 2010

Filed:

Dec. 05, 2006
Applicants:

Thomas J Fitzgerald, Phoenix, AZ (US);

Carl L. Deppisch, Chandler, AZ (US);

Manjit Dhindsa, Phoenix, AZ (US);

Mark Norwil, Chandler, AZ (US);

Matthew J. Schaenzer, Phoenix, AZ (US);

Inventors:

Thomas J Fitzgerald, Phoenix, AZ (US);

Carl L. Deppisch, Chandler, AZ (US);

Manjit Dhindsa, Phoenix, AZ (US);

Mark Norwil, Chandler, AZ (US);

Matthew J. Schaenzer, Phoenix, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.


Find Patent Forward Citations

Loading…