This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2007-2010.
Company Filing History:
Years Active: 2007-2010
Title: Mark Norwil: Innovator in Electronic Packaging Technology
Introduction
Mark Norwil is a prominent inventor based in Chandler, AZ (US). He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on improving the efficiency and effectiveness of electronic assemblies.
Latest Patents
Mark Norwil's latest patents include an innovative electronic packaging apparatus and method. This invention features an electronic assembly that consists of a substrate, a device attached to the substrate, and a thermally conductive heat spreader that covers the device and a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. The method involves attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.
Career Highlights
Mark Norwil is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies in electronic packaging. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.
Collaborations
Some of his notable coworkers include Thomas John Fitzgerald and Carl L Deppisch. Their collaboration has contributed to the innovative environment at Intel Corporation.
Conclusion
Mark Norwil's contributions to electronic packaging technology highlight his role as a key inventor in the field. His patents reflect a commitment to innovation and excellence in electronic assembly design.