Company Filing History:
Years Active: 2009-2010
Title: The Innovative Contributions of Matthew Escobido
Introduction
Matthew Escobido is a notable inventor based in Quezon, Philippines. He has made significant contributions to the field of technology, particularly in the area of semiconductor manufacturing. With a total of 2 patents to his name, Escobido's work has garnered attention for its innovative approaches and practical applications.
Latest Patents
One of Escobido's latest patents is focused on C4 joint reliability. In this invention, he provides a method that involves fabricating a die bump on a die. The die bump is specifically shaped and dimensioned to reduce the flow of solder material used to attach it to a package substrate. This method also addresses the under bump metallurgy (UBM) layer located below the die bump. Notably, the process allows for a substrate reflow operation to attach the package substrate to the die bump without the need for a separate wafer reflow operation.
Career Highlights
Matthew Escobido is currently employed at Intel Corporation, a leading company in the technology sector. His work at Intel has allowed him to explore and develop innovative solutions that enhance the reliability and efficiency of semiconductor devices. His contributions have been instrumental in advancing the company's technological capabilities.
Collaborations
Throughout his career, Escobido has collaborated with several talented individuals, including Sairam Agraharam and Carlton E. Hanna. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Matthew Escobido's innovative work in semiconductor technology exemplifies the impact of dedicated inventors in the field. His patents and contributions continue to influence advancements in the industry, showcasing the importance of innovation in technology.