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Boise, ID, United States of America

Matt E Schwab

USPTO Granted Patents = 40 (Patent Applications = 2)

Average Co-Inventor Count = 3.0

ph-index = 7

Forward Citations = 175(Granted Patents)

Company Filing History:

37 out of 38,002

Micron Technology Incorporated

Round Rock Research, LLC

Years Active: 2003-2020

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Areas of Expertise:

Packaged Semiconductor Components

Microelectronic Devices

System In Package

Multi-Chip Module

Bond Pad Rerouting

Routing Elements

Integrated Circuit Device

Solder Mask

Carrier Substrate

Manufacturing Methods

Semiconductor Device Assemblies

Fiducial Design

40 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10763185 - Packaged semiconductor components having substantially rigid support members (2020-09-01),

2. 10692827 - Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices (2020-06-23),

3. 10312173 - Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components (2019-06-04),

4. 10297574 - System in package (SIP) with dual laminate interposers (2019-05-21),

5. 10163826 - Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices (2018-12-25),

6. 9960094 - Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components (2018-05-01),

7. 9812415 - Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices (2017-11-07),

8. 9362208 - Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components (2016-06-07),

9. 8987885 - Packaged microdevices and methods for manufacturing packaged microdevices (2015-03-24),

10. 8866272 - Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices (2014-10-21),

11. 8735183 - System in package (SIP) with dual laminate interposers (2014-05-27),

12. 8354301 - Packaged microdevices and methods for manufacturing packaged microdevices (2013-01-15),

13. 8048715 - Multi-chip module and methods (2011-11-01),

14. 7955898 - Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices (2011-06-07),

15. 7944057 - Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices (2011-05-17),

Title: The Innovative Journey of Matt E Schwab

Introduction: Matt E Schwab is a pioneering inventor based in Boise, Idaho. With a passion for creating groundbreaking solutions, he has made significant contributions to the field of innovations.

Latest Patents: Matt E Schwab holds several patents in various industries, showcasing his diverse range of expertise and inventive spirit. His latest patents focus on cutting-edge technologies that aim to revolutionize the way we live and work.

Career Highlights: Throughout his illustrious career, Matt E Schwab has consistently pushed the boundaries of what is possible. His innovative mindset and dedication to excellence have led to the development of groundbreaking inventions that have the potential to shape the future.

Collaborations: Matt E Schwab has collaborated with leading experts in the industry, bringing together diverse perspectives and skill sets to drive innovation forward. His ability to work effectively in teams has been instrumental in the success of many projects.

Conclusion: In conclusion, Matt E Schwab is a visionary inventor who continues to make a lasting impact on the world of innovations. His relentless pursuit of excellence and passion for creating a better future serve as an inspiration to aspiring inventors everywhere.

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