The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Jun. 07, 2011
Matt E. Schwab, Boise, ID (US);
J. Michael Brooks, Caldwell, ID (US);
David J. Corisis, Nampa, ID (US);
Matt E. Schwab, Boise, ID (US);
J. Michael Brooks, Caldwell, ID (US);
David J. Corisis, Nampa, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.