Company Filing History:
Years Active: 2024
Title: Máté Jenei: Innovator in Quantum Computing Technologies
Introduction
Máté Jenei is a prominent inventor based in Espoo, Finland. He has made significant contributions to the field of quantum computing through his innovative patents. With a total of 3 patents, Jenei is recognized for his advancements in chip fabrication and electroplating methods.
Latest Patents
One of Jenei's latest patents is titled "Electroplating for vertical interconnections." This invention relates to a method for forming flip chip bumps using electroplating. The method allows the formation of flip chip bumps in a way that is compatible with already-formed sensitive electronic components, such as Josephson junctions, which may be used in quantum processing units. The invention also includes a product and a flip chip package in which flip chip bumps are formed with the disclosed method.
Another notable patent is "Chip fabrication method and product including raised and recessed alignment structures." This invention focuses on the fabrication of superconducting integrated circuits for use in quantum computers. Raised and recessed alignment structures are provided on the surfaces of two substrates, allowing for precise positioning and alignment during flip chip bonding.
Career Highlights
Máté Jenei is currently employed at Iqm Finland Oy, where he continues to work on cutting-edge technologies in quantum computing. His expertise in chip fabrication and electroplating has positioned him as a key player in the industry.
Collaborations
Jenei collaborates with talented individuals such as Kok Wai Chan and Kuan Yen Tan, contributing to the advancement of quantum technologies through teamwork and shared knowledge.
Conclusion
Máté Jenei's innovative work in the field of quantum computing, particularly through his patents, showcases his commitment to advancing technology. His contributions are paving the way for future developments in this exciting area of research.