Iqm Finland Oy

Máté Jenei

Juha Hassel

Kok Wai Chan

Tianyi Li

Wei Liu

Mikko Möttönen

Johannes Heinsoo

Kuan Yen Tan

Caspar Ockeloen-Korppi

Jan Goetz

Hasnain Ahmad

Manjunath Ramachandrappa Venkatesh

Vasilii Sevriuk

Tiina Naaranoja

Lily Yang

Jean-Luc Orgiazzi

Alessandro Landra

Mario Palma

The invention relates to a method for forming flip chip bumps using electroplating. The method allows the formation of flip chip bumps in a way that is compatible with already-formed sensitive electronic components, such as Josephson junctions, which may be used in quantum processing units. The invention also relates to a product and a flip chip package in which flip chip bumps are formed with the disclosed method.

Electroplating for vertical interconnections

The invention relates to the field of chip fabrication, in particular to the fabrication of superconducting integrated circuits for use in quantum computers. Raised and recessed alignment structures are provided on the surfaces of two substrate such that the raised and recessed alignment structure extends within the recessed alignment structure to a maximum depth determined by the geometry of the alignment structures. The alignment structures act as a hard stop for positioning and aligning the substrates for flip chip bonding.

Chip fabrication method and product including raised and recessed alignment structures

A three-dimensional superconducting qubit and a method for manufacturing the same are disclosed. In an example, a three-dimensional superconducting qubit comprises a structural base comprising one or more insulating materials, and superconductive patterns on surfaces of the structural base. The superconductive patterns form at least a capacitive part and an inductive part of the three-dimensional superconducting qubit. A first surface of the surfaces of the structural base defines a first plane and a second surface of the surfaces of the structural base defines a second plane, the second plane being oriented differently than the first plane. At least one superconductive pattern of the superconductive patterns extends from the first surface to the second surface.

Three-dimensional superconducting qubit and a method for manufacturing the same

Growing community of inventors

Espoo, Finland

Máté Jenei