The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2024
Filed:
May. 02, 2022
Iqm Finland Oy, Espoo, FI;
Máté Jenei, Espoo, FI;
Kok Wai Chan, Espoo, FI;
Hasnain Ahmad, Espoo, FI;
Manjunath Ramachandrappa Venkatesh, Espoo, FI;
Wei Liu, Espoo, FI;
Lily Yang, Espoo, FI;
Tianyi Li, Espoo, FI;
Jean-Luc Orgiazzi, Espoo, FI;
Caspar Ockeloen-Korppi, Espoo, FI;
Alessandro Landra, Espoo, FI;
Mario Palma, Espoo, FI;
IQM Finland Oy, Espoo, FI;
Abstract
The invention relates to a method for forming flip chip bumps using electroplating. The method allows the formation of flip chip bumps in a way that is compatible with already-formed sensitive electronic components, such as Josephson junctions, which may be used in quantum processing units. The invention also relates to a product and a flip chip package in which flip chip bumps are formed with the disclosed method.