Masuo Hotta

Title: Masuo Hotta: Innovator in Low-Melting Alloys

Introduction

Masuo Hotta is a notable inventor based in Akishima, Japan. He is recognized for his contributions to the field of materials science, particularly in the development of low-melting alloys. His innovative work has led to advancements in soldering technology, which are essential in various electronic applications.

Latest Patents

Masuo Hotta holds a patent for a low-melting alloy and cream solder that utilizes a powder of the alloy. The composition includes silver (Ag) and copper (Cu) added to a base material of tin (Sn), lead (Pb), and bismuth (Bi). This alloy is designed to have a low melting point ranging from 120 to 150 degrees Celsius, ensuring it melts effectively at reflow temperatures between 170 and 200 degrees Celsius. The optimal addition amounts are specified as 0.1 to 5 wt % for Ag and 0.05 to 1.0 wt % for Cu. This innovation provides a low-melting alloy that meets performance requirements while being cost-effective and safe.

Career Highlights

Throughout his career, Masuo Hotta has worked with prominent companies, including Toshiba Corporation and Alpha Metals of Japan Ltd. His experience in these organizations has contributed significantly to his expertise in materials and alloy development.

Collaborations

Masuo Hotta has collaborated with notable colleagues such as Koichi Aono and Tadahiro Toki. Their combined efforts have furthered advancements in the field of low-melting alloys and soldering technologies.

Conclusion

Masuo Hotta's contributions to the development of low-melting alloys have made a significant impact in the electronics industry. His innovative patent and collaborations highlight his role as a key inventor in this specialized field.