The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2000
Filed:
Jul. 12, 1996
Tadahiro Toki, Sagamihara, JP;
Masayoshi Yamaguchi, Kokubunji, JP;
Koichi Aono, Tachikawa, JP;
Hirofumi Sakamoto, Ome, JP;
Yasuhide Ogasawara, Kodaira, JP;
Masuo Hotta, Akishima, JP;
Akihiro Kiyosue, Isehara, JP;
Takao Enomoto, Hiratsuka, JP;
Toshiba Corp., Kanagawa-ken, JP;
Alpha Metals of Japan Ltd., Kanagawa-ken, JP;
Abstract
Ag and Cu are added to a base material of a Sn/Pb/Bi composition. Since Bi is contained in greater quantities in Sn/Pb, the alloy has a low melting point (120 to 150.degree. C.) and is surely melted at reflow temperatures from 170 to 200.degree. C. Preferably, the addition amount of Ag is from 0.1 to 5 wt % and the addition amount of Cu is from 0.05 to 1.0 wt %. A low-melting alloy having all the required performances and excellent with view points of cost and safety and a cream solder using a powder of the alloy can be obtained.