Tokyo, Japan

Masayuki Kaneko

USPTO Granted Patents = 2 

Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2002-2005

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2 patents (USPTO):Explore Patents

Title: Masayuki Kaneko: Innovator in Laser Beam Machining

Introduction

Masayuki Kaneko is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of laser beam machining, particularly in the development of methods and apparatuses for wiring boards. With a total of 2 patents to his name, Kaneko's work has advanced the capabilities of precision machining in electronics.

Latest Patents

Kaneko's latest patents include a laser beam machining method for wiring boards, a laser beam machining apparatus for wiring boards, and a carbonic acid gas laser oscillator for machining wiring boards. In his laser beam machining method, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 µs and with energy density of about 20 J/cm or more. This innovative approach allows for various machining processes, such as drilling for through-holes and blind via holes, grooving, and cutting for an outside shape.

Career Highlights

Kaneko is associated with Mitsubishi Electric Corporation, where he has been instrumental in advancing laser machining technologies. His expertise in this area has positioned him as a key figure in the development of efficient and precise manufacturing processes.

Collaborations

Throughout his career, Kaneko has collaborated with notable colleagues, including Miki Kurosawa and Tsukasa Fukushima. These partnerships have fostered innovation and contributed to the success of various projects within the company.

Conclusion

Masayuki Kaneko's contributions to laser beam machining have significantly impacted the electronics manufacturing industry. His innovative patents and collaborative efforts continue to drive advancements in precision machining technologies.

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