The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2002
Filed:
Apr. 14, 2000
Applicant:
Inventors:
Miki Kurosawa, Tokyo, JP;
Tsukasa Fukushima, Tokyo, JP;
Masanori Mizuno, Tokyo, JP;
Shozui Takeno, Tokyo, JP;
Masaharu Moriyasu, Tokyo, JP;
Masayuki Kaneko, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Toyko, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 2/638 ;
U.S. Cl.
CPC ...
B23K 2/638 ;
Abstract
In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.