The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 16, 2002

Filed:

Apr. 14, 2000
Applicant:
Inventors:

Miki Kurosawa, Tokyo, JP;

Tsukasa Fukushima, Tokyo, JP;

Masanori Mizuno, Tokyo, JP;

Shozui Takeno, Tokyo, JP;

Masaharu Moriyasu, Tokyo, JP;

Masayuki Kaneko, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 2/638 ;
U.S. Cl.
CPC ...
B23K 2/638 ;
Abstract

In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 &mgr;s and with energy density of about 20 J/cm or more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.


Find Patent Forward Citations

Kurosawa, Miki. (2002). Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board (U.S. Patent No. 6373026). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6373026

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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