The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 06, 2005

Filed:

Nov. 28, 2001
Applicants:

Miki Kurosawa, Tokyo, JP;

Tsukasa Fukushima, Tokyo, JP;

Masanori Mizuno, Tokyo, JP;

Shozui Takeno, Tokyo, JP;

Masaharu Moriyasu, Tokyo, JP;

Masayuki Kaneko, Tokyo, JP;

Inventors:

Miki Kurosawa, Tokyo, JP;

Tsukasa Fukushima, Tokyo, JP;

Masanori Mizuno, Tokyo, JP;

Shozui Takeno, Tokyo, JP;

Masaharu Moriyasu, Tokyo, JP;

Masayuki Kaneko, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K026/38 ;
U.S. Cl.
CPC ...
Abstract

In a laser beam machining method for a wiring board, a machined portion of the wiring board is irradiated with a pulsed laser beam for a beam irradiation time ranging from about 10 to about 200 μs and with energy density of about 20 J/cmor more, thereby machining the wiring board, for example, drilling for a through-hole and a blind via hole, grooving, and cutting for an outside shape.


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