Tokyo, Japan

Masayuki Ando

This inventor holds 27 USPTO granted patents and 6 EPO patents, primarily in Semiconductor Technology. Top assignees: Dai Nippon Printing Co., Ltd., Mitsubishi Electric Corporation, Nippon Oil Company. Active years: 1991-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Masayuki Ando. Retrieved from https://idiyas.com/inventor/masayuki-ando

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 85.2

 

Average Co-Inventor Count = 4.1

ph-index = 13

Forward Citations = 337(Granted Patents)


Location History:

  • Yokohama, JP (1991)
  • Kashiwa, JP (1996 - 1997)
  • Funabashi, JP (1996 - 2000)
  • Tokyo-To, JP (1998 - 2004)
  • Kawasaki, JP (2015 - 2016)
  • Kanagawa, JP (2016)
  • Tokyo, JP (1993 - 2020)

Company Filing History:


Years Active: 1991-2026

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Areas of Expertise:
Servo Amplifier
Semiconductor Package
Semiconductor Device
Switchgear Mechanism
Power Conversion
Antistatic Coat
Thermal Transfer Sheet
Color Filter
Liquid Crystal Display
Polymer Dispersion
Thermosetting Compositions
Light-Shielding Layer
27 patents (USPTO):Explore Patents

Title: Innovations by Masayuki Ando: Pioneering Semiconductor Technology

Introduction

Masayuki Ando, a notable inventor based in Tokyo, Japan, has contributed significantly to the field of semiconductor technology, holding an impressive 23 patents. His innovations are centered around enhancing the functionality and reliability of semiconductor packages and devices, marking him as a vital figure in this industry.

Latest Patents

One of Masayuki Ando's latest patents focuses on a semiconductor package. This innovative design includes an insulating substrate with a circuit pattern, housing a semiconductor device positioned atop the circuit. The package is encased with a protective case, offering external terminals for electrical connections both inside and outside the case. A crucial feature of this invention is the inner wire, which connects the circuit pattern or semiconductor device to the external terminal. This wire includes a fusion portion that melts when excessive current passes through, adding a crucial safety mechanism. Moreover, the package is sealed with resin, and a lid is affixed to the top surface, incorporating a scattering prevention part that protects the fusion portion, ensuring it remains covered while allowing for adequate ventilation.

Career Highlights

Masayuki Ando has had a remarkable career, collaborating with prominent companies such as Dai Nippon Printing Co., Ltd. and Mitsubishi Electric Corporation. His work at these institutions has laid the groundwork for his inventive prowess in semiconductor technologies.

Collaborations

Throughout his career, Ando has had the opportunity to collaborate with esteemed colleagues, including Yutaka Otsuki and Rei Yoneyama. These partnerships have facilitated the exchange of ideas and further propelled innovations in their respective fields.

Conclusion

Masayuki Ando's contributions to the semiconductor industry through his patents reflect his dedication to advancing technology. His inventions not only improve the performance of semiconductor devices but also introduce safety features that benefit manufacturers and consumers alike. As a leading inventor in Japan, he continues to inspire future innovations in the technology sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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