This inventor holds 1 USPTO granted patent. Top assignee: Disco Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Masayoshi Teramoto: Innovator in Wafer Grinding Technology
Introduction
Masayoshi Teramoto is a prominent inventor based in Tokyo, Japan. He is known for his innovative contributions to the field of semiconductor manufacturing, particularly in wafer grinding technology. His work has significantly impacted the efficiency and effectiveness of wafer processing.
Latest Patents
Masayoshi Teramoto holds a patent for a wafer grinding method. This method involves grinding the reverse side of a wafer using a grindstone while employing a protective member to cover the face side of the wafer. The process includes a protective member forming step, a holding step using a chuck table, and a grinding step that utilizes grinding water containing a surfactant.
Career Highlights
Teramoto is associated with Disco Corporation, a leading company in the semiconductor equipment industry. His expertise in wafer grinding has positioned him as a key figure in advancing manufacturing techniques within the sector.
Collaborations
Throughout his career, Masayoshi Teramoto has collaborated with notable colleagues, including Kenji Takenouchi and Mitsutane Kokubu. These partnerships have fostered innovation and development in their respective fields.
Conclusion
Masayoshi Teramoto's contributions to wafer grinding technology exemplify his commitment to innovation in the semiconductor industry. His patent and work at Disco Corporation highlight his role as a significant inventor in this field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile