The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 2026
Filed:
Mar. 27, 2024
Disco Corporation, Tokyo, JP;
Kenji Takenouchi, Tokyo, JP;
Mitsutane Kokubu, Tokyo, JP;
Masayoshi Teramoto, Tokyo, JP;
Koichi Kunimoto, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer grinding method for grinding, by a grindstone, a reverse side of a wafer formed on a face side thereof with devices includes a protective member forming step of covering a whole area of the face side of the wafer with a protective member, a holding step of holding the wafer by a chuck table with the protective member therebetween, and a grinding step of grinding the reverse side of the wafer by the grindstone while supplying grinding water containing a surfactant to the grindstone and the wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile