Company Filing History:
Years Active: 2009-2012
Title: Innovations by Masayoshi Sekizawa
Introduction
Masayoshi Sekizawa is a notable inventor based in Niigata, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the development of polishing methods and materials. With a total of 2 patents to his name, Sekizawa's work has had a considerable impact on the industry.
Latest Patents
Sekizawa's latest patents include a method for manufacturing a polishing pad and a method for polishing a wafer. The method for manufacturing a polishing pad involves creating a urethane foam pad that is attached to a turntable for wafer polishing. This process includes slicing a urethane foam cake and applying press processing with a pressure of 15000 g/cm or above. The resulting polishing pad is designed to achieve high flatness in the wafers being polished.
The second patent focuses on a method for producing semiconductor wafers. This method includes a double-side polishing step and a chamfered-portion polishing step. The first step polishes the chamfered portion of the wafer to ensure that the chamfered surface is in contact with the polishing pad. The double-side polishing is then performed, followed by a second chamfered-portion polishing step. This innovative approach helps to remove scratches generated during the double-side polishing process and prevents excessive polishing on the main surface of the wafer.
Career Highlights
Masayoshi Sekizawa is associated with Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His work has contributed to advancements in wafer production techniques, enhancing the quality and efficiency of semiconductor manufacturing.
Collaborations
Sekizawa has collaborated with notable coworkers such as Tadahiro Kato and Mamoru Okada. Their combined expertise has furthered the development of innovative solutions in the semiconductor field.
Conclusion
Masayoshi Sekizawa's contributions to the semiconductor industry through his patents and collaborative efforts highlight his role as a key innovator. His work continues to influence the methods used in wafer production, ensuring high-quality outcomes in semiconductor manufacturing.