Masato Udaka

Title: Masato Udaka: Innovator in Semiconductor Technology

Introduction

Masato Udaka is a notable inventor based in Hyogo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the reliability and efficiency of semiconductor package components and printed circuit boards.

Latest Patents

Udaka's latest patents include a "Mounting method and mounting structure for semiconductor package component." This invention describes a method where a semiconductor package component is mounted on a substrate, ensuring that the electrodes of both components are in contact through a joining material. A reinforcing adhesive is applied to enhance the connection, followed by a reflow process to solidify the joining metal.

Another significant patent is for a "Printed circuit board and mounting structure for surface mounted device." This invention provides a printed circuit board designed to ensure joint strength and reliability when mounting surface-mounted devices. The design includes a BGA package with solder balls that connect to mounting pads on the printed circuit board, enhancing the overall performance of the assembly.

Career Highlights

Throughout his career, Masato Udaka has worked with prominent companies such as Panasonic Intellectual Property Management Co., Ltd. and Panasonic Corporation. His experience in these organizations has allowed him to develop innovative solutions in semiconductor technology.

Collaborations

Udaka has collaborated with notable colleagues, including Seiji Tokii and Naomichi Ohashi. Their combined expertise has contributed to advancements in the field of semiconductor packaging and printed circuit board design.

Conclusion

Masato Udaka's contributions to semiconductor technology through his patents and career achievements highlight his role as an influential inventor. His work continues to impact the industry, ensuring improved reliability and efficiency in electronic devices.