Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Masato Udaka

Seiji Tokii

Atsushi Yamaguchi

Arata Kishi

Naomichi Ohashi

A semiconductor package component () is mounted on a substrate () in such a manner that an electrode () of the substrate () and an electrode of the semiconductor package component () are brought into contact with each other through a joining material (). A reinforcing adhesive () is applied between the substrate () and the outer surface of the semiconductor package component (). Then, reflow is performed to melt the joining metal () with the reinforcing adhesive () uncured. After the reinforcing adhesive () is cured, the joining metal () is solidified.

Mounting method and mounting structure for semiconductor package component

The present invention provides a printed circuit board capable of sufficiently ensuring joint strength and joint reliability when mounting a surface mounted device, and a mounting structure for a surface mounted device using the printed circuit board. A BGA package as a surface mounted device includes a plurality of solder balls arranged thereon and a printed circuit board includes a plurality of mounting pads corresponding respectively to the plurality of solder balls. The BGA package is connected to the mounting pads on the printed circuit board due to melting of the solder balls, thereby mounted on the printed circuit board. A concave via hole is formed on each of the mounting pads having a circular surface shape and a part of the solder ball is in the convex via hole. Here, the center of the convex via hole is apart from the center of each of the mounting pads by at least the diameter of the concave via hole.

Growing community of inventors

Hyogo, Japan

Masato Udaka