The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2016
Filed:
Nov. 27, 2013
Naomichi Ohashi, Hyogo, JP;
Atsushi Yamaguchi, Osaka, JP;
Arata Kishi, Nara, JP;
Masato Udaka, Hyogo, JP;
Seiji Tokii, Osaka, JP;
Naomichi Ohashi, Hyogo, JP;
Atsushi Yamaguchi, Osaka, JP;
Arata Kishi, Nara, JP;
Masato Udaka, Hyogo, JP;
Seiji Tokii, Osaka, JP;
Abstract
A semiconductor package component () is mounted on a substrate () in such a manner that an electrode () of the substrate () and an electrode of the semiconductor package component () are brought into contact with each other through a joining material (). A reinforcing adhesive () is applied between the substrate () and the outer surface of the semiconductor package component (). Then, reflow is performed to melt the joining metal () with the reinforcing adhesive () uncured. After the reinforcing adhesive () is cured, the joining metal () is solidified.